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Stabilization of Plasma-Polymerized Organic Coatings

IP.com Disclosure Number: IPCOM000119230D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 1 page(s) / 22K

Publishing Venue

IBM

Related People

L Bruning III, F: AUTHOR [+4]

Abstract

The surface energy of thin films of plasma-polymerized organic coatings tends to increase after exposure to air, water, or other solvents reducing the effectiveness of the films to repel moisture.

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Stabilization of Plasma-Polymerized Organic Coatings

      The surface energy of thin films of plasma-polymerized
organic coatings tends to increase after exposure to air, water, or
other solvents reducing the effectiveness of the films to repel
moisture.

      A method is described to stabilize or to reduce the surface
energy effectively by converting hydrophilic groups to hydrophobic
groups via chemical reactions.

      As an example, the thin film coating, e.g., on a wafer or
plate, is placed in a beaker containing a fluorinated acid anhydride,
such as trifluoroacetic anhydride, in ethyl acetate with a drop or
two of triethylamine.  After heating and washing, the wafer coating
has a higher and more stable contact angle.

      An alternate method is to treat the wafer with a solution of
diphenylamine in methanol to effect similar results.