Browse Prior Art Database

Filling of Microsocket Cavities With Mercury

IP.com Disclosure Number: IPCOM000119278D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Yogi, T: AUTHOR

Abstract

In the Josephson device technology, electrical and wiring connections among cards on a board are made through arrays of pin-microsocket-pins. The microsocket board is fabricated by bonding two wafers which are anisotropically etched from both sides. This creates diamond-shaped cavities in the boards which are then filled by liquid mercury. A method is described for uniformly filling each cavity in the array with the same amount of mercury.

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Filling of Microsocket Cavities With Mercury

      In the Josephson device technology, electrical and wiring
connections among cards on a board are made through arrays of
pin-microsocket-pins.  The microsocket board is fabricated by bonding
two wafers which are anisotropically etched from both sides.  This
creates diamond-shaped cavities in the boards which are then filled
by liquid mercury.  A method is described for uniformly filling each
cavity in the array with the same amount of mercury.

      In Fig. 1, a metering wafer 10 is used to provide a controlled
amount of mercury into each of the arrays in the microsocket board.
Wafer 10 contains tetrahedral cavities 12 whose thickness is such
that each cavity 12 has a small opening at the bottom.  Metering
wafer 10 is sandwiched between two quartz plates 16A, 16B and filled
with mercury in a mercury bath contained in a vacuum pressure
chamber.

      After excess mercury is squeezed out and plates 16A, 16B are
removed, an array of mercury balls 18 is obtained whose volume is
defined by the volume of the cavities 12. This is shown in Fig. 2.

      The array of mercury balls 18 is then transferred to the
openings in the microsocket board 20.  A mating wafer 22 is used to
press the mercury balls 18 into the microsocket cavities 24, as shown
in Fig. 4.  Mating wafer 22 is also fabricated by anisotropic etching
with the use of a reverse polarity mask of the board socket array.

      All cavities 24 in...