Browse Prior Art Database

Short Cycle Prototype Three-Dimensional Molded Circuit Boards

IP.com Disclosure Number: IPCOM000119327D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Related People

Hancock, TA: AUTHOR [+2]

Abstract

Disclosed is a method of producing prototype three-dimensional circuit boards quickly. Circuit board substrate configurations can be produced rapidly using stereolithography techniques. Laser ablation of photoresist applied to these boards will allow the rapid production of prototype circuit boards in both flat form and three-dimensional form.

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Short Cycle Prototype Three-Dimensional Molded Circuit Boards

      Disclosed is a method of producing prototype
three-dimensional circuit boards quickly.  Circuit board substrate
configurations can be produced rapidly using stereolithography
techniques.  Laser ablation of photoresist applied to these boards
will allow the rapid production of prototype circuit boards in both
flat form and three-dimensional form.

      Three-dimensional molded circuit boards are typically
circuitized with a specially shaped phototool which has the same
contour as the surface of the circuit board.  This phototool is used
to image the circuit paths onto a resist layer which can be then
selectively washed away exposing platable substrate underneath.
Construction time of this phototool generally is gated by the
necessity of having actual molded cards (which take approximately 12
weeks to obtain) available for the phototool maker's reference.  In
addition, the construction of the phototool requires 6-8 weeks for a
total of 18-20 weeks from the completion of engineering drawings to
parts in hand.

      The steps in utilizing this method of rapid prototyping are:
Create a model circuit board by sterolithography. Coat the model
circuit board with a conductive overcoating and a plating resist
layer.  Using a laser, ablate away the plating resist layer to the
underlying platable substrate. Plate the full thickness of copper
required for the circuit traces.  Strip away the resist la...