Browse Prior Art Database

Overheat Protection Or Control Means for Semiconductor Chips

IP.com Disclosure Number: IPCOM000119358D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Kaiser, V: AUTHOR

Abstract

This article describes a means that serves to readily and quickly determine semiconductor memory chips that have failed as a result of overheating.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Overheat Protection Or Control Means for Semiconductor Chips

      This article describes a means that serves to readily and
quickly determine semiconductor memory chips that have failed as a
result of overheating.

      The illustrated sectional plan and perspective view of the chip
shows how a meander-shaped conductor structure is applied to the fin
ished chip after deposition of the polyimide covering layer. The
material of the conductors is chosen such that, in the case of local
overheating, the conductor melts.  The interruption may be readily
localized by measuring the current-flow resistance of the conductor,
thus determining the memory chip affected.

      By using a conductor structure of temperature-dependent
material, it is also possible to monitor the temperature of the
memory and to switch off before overheating occurs.