Browse Prior Art Database

Modular Board-To-Board Packaging

IP.com Disclosure Number: IPCOM000119367D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Bernhardt, HG: AUTHOR [+2]

Abstract

Two or several boards which are directly connected to each other may be combined, using plugs or flex pieces but no additional cables.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 84% of the total text.

Modular Board-To-Board Packaging

      Two or several boards which are directly connected to
each other may be combined, using plugs or flex pieces but no
additional cables.

      In addition, one or several such boards may be provided with
components, modules or cards on one or both sides (Figs. 1 to 3).

      This packaging method optimizes the use of several packaging
concepts existing in a machine and allows combining the applications
afforded by them in a new machine.  There are no limitations with
regard to card formats, so that packaging requirements may be met
more flexibly (meaning that card surfaces are utilized more
effectively and that extensions may be readily made).  Critical paths
on a board may be integrated and critical line lengths be minimized,
leading to higher computing speeds.

      It is possible, for example, to integrate the PU and the memory
on one board and the various I/O cards on another.

      By direct packaging, the described method reduces the number of
cable and plug connections, thus cutting down costs and improving the
reliability of the system, as there are fewer components.

      The described method also allows the connection of power
boards, using a reduced number of cables and plugs, and the
insulation of critical components and paths on a secondary board by
decoupling the PU memory bus. Particularly, hot components may be
separately cooled on a secondary board to avoid heat dissipation to
cards on the...