Browse Prior Art Database

Planar I/O Port

IP.com Disclosure Number: IPCOM000119381D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Neer, JH: AUTHOR [+2]

Abstract

This article describes a technique and design whereby personal computer (PC) ports may be stacked two or three connectors high above a planar board to accommodate additional port requirements.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 72% of the total text.

Planar I/O Port

      This article describes a technique and design whereby
personal computer (PC) ports may be stacked two or three connectors
high above a planar board to accommodate additional port
requirements.

      PC I/O ports typically consist of a single row of connectors
soldered along the rear edge of the planar board such that they are
accessible through an opening in the rear cover.

      As PCs become more sophisticated, more ports are required to
communicate with all of the various functions that are available
within the PC.  Dual serial ports, dual parallel ports, modem ports,
and small computer system interface (SCSI) ports are examples of
ports that would be used today if the method for incorporating them
into a system were available.

      As the rear of a system is viewed, it is evident that there is
insufficient length available to fit any additional connectors along
the rear edge of the planar board.  Another design constraint which
must now be considered is the continual size reduction requirement
for the planar board itself.

      A number of stacked D shell connectors (not shown) are
available on the market as a means to meet this need.  They reduce
the intrinsic manufacturability, testability, and handling
efficiencies found in the conventional one-high connector approach.
The additional height of the connectors reduces the test capacity and
the planar board packaging by at least one half.  The increased
temperatures req...