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Method for Cleaning Wax From Soft Gold Printed Circuit Board Tabs

IP.com Disclosure Number: IPCOM000119401D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 1 page(s) / 42K

Publishing Venue

IBM

Related People

Beach, BL: AUTHOR [+5]

Abstract

Disclosed is a method for cleaning organic contaminants from soft gold connector tabs.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 74% of the total text.

Method for Cleaning Wax From Soft Gold Printed Circuit Board Tabs

      Disclosed is a method for cleaning organic contaminants
from soft gold connector tabs.

      Printed circuit board (PCB) connector tabs often require the
use of gold for proper function.  If the tabs become contaminated by
an adhesive or wax, it is necessary to clean the contacts.
Paraffinic waxes are especially difficult to remove, and result in
electrical failure since the connector pins do not penetrate through
waxy contaminants.

      There are three main cleaning methods currently used by
industry.  First, a plastic eraser can be employed. Although this
removes some contaminants, it will not completely remove a wax.
Second, a fine grit sandpaper can be used on the surface, but this
method is too abrasive for the soft, thin plating.  Finally, a
solvent, such as toluene or 1,1,1 trichlorethane, can be wiped across
the tabs.  This method has several drawbacks in that it leaves a
residue, wicks under the surface to be cleaned, and may merely move
the contaminant around without truly removing it.

      This article covers a new method for cleaning soft gold contact
tabs without seriously damaging the surface or removing gold.  The
method uses heat to loosen the wax contaminant, and an aramid fiber
felt to remove it.  The aramid felt was chosen over cotton,
polyester, and plastic scrubbing pads due to its heat resistance, oil
wicking capability, and effectiveness.

      A pi...