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Parallel Chemical Recovery And Copper Regeneration System

IP.com Disclosure Number: IPCOM000119408D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 1 page(s) / 45K

Publishing Venue

IBM

Related People

Czarnecki, KR: AUTHOR [+3]

Abstract

Disclosed is a system which recovers both metallic copper and dissolved copper, while acting as a cupric chloride regeneration system.

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This is the abbreviated version, containing approximately 81% of the total text.

Parallel Chemical Recovery And Copper Regeneration System

      Disclosed is a system which recovers both metallic copper and
dissolved copper, while acting as a cupric chloride regeneration
system.

      Basically, the system takes in spent cupric chloride solution
(cuprous chloride), from circuit panel etching operations and scrap
copper, and then outputs regenerated cupric chloride, solid copper,
and hydrogen gas; useful as fuel.

      The spent cupric chloride solution passes through a first
reactor in which chlorine gas (emitted from the electroplating cells;
described below) reacts with the cuprous chloride to form cupric
chloride.  The next reactor reacts scrap copper with the cupric
chloride to again form cuprous chloride, but at double the amount at
the atomic level.  Next, the cuprous chloride solution passes into
electroplating cells in which extremely pure copper and hydrogen gas
are produced at the cathode.  At the anode, chlorine gas is generated
along with very small amounts of oxygen (depending on the anode
material).  This chlorine gas is then introduced at reduced pressure
to the final reactor in which spent cupric chloride solution is held.
The cuprous chloride is then regenerated into cupric chloride, which
can then be used in the panel plant etch operations. Finally, the
excess chlorine gas is pumped into the first reactor to regenerate
spent cupric chloride solution for scrap copper processing (described
above).

      The key to ...