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Novel Low Residue Water Flux Compositions

IP.com Disclosure Number: IPCOM000119411D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Related People

Golden, HJ: AUTHOR [+5]

Abstract

Disclosed are three novel formulations for low residue water soluble fluxes (Table 1). These fluxes exhibit excellent solderability with tin-lead solder on copper printed circuit boards. Printed circuit boards with line spacings of 0.102mm (4 mils) and vias of 0.305mm (12 mils) diameter soldered easily.

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Novel Low Residue Water Flux Compositions

      Disclosed are three novel formulations for low residue water
soluble fluxes (Table 1).  These fluxes exhibit excellent
solderability with tin-lead solder on copper printed circuit boards.
Printed circuit boards with line spacings of 0.102mm (4 mils) and
vias of 0.305mm (12 mils) diameter soldered easily.

      The flux residues are easily removed from the boards with
deionized water at room temperature after soldering operations.
Corrosive ions are thus easily removed.

      These fluxes eliminate the need for chlorofluorocarbon cleaning
of printed circuit boards.
                           TABLE 1
               Water Soluble Flux Formulations
=============================================================
Constituent         Formulation    Formulation    Formulation
Chemical (w/w)      I(%)           II(%)          III(%)
Citric Acid         11.9           11.9            9.2
Ethylene Glycol     55.3           55.4           56.9
Ethanol             23.5           23.5           24.2
Glycerin             1.2            1.2            1.3
Water                7.9            8.0            8.2
Tergitol             0.2            ---            0.2
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