Browse Prior Art Database

Mixed Gull Wing / Solder Ball Connect Module for Surface Mount Technology

IP.com Disclosure Number: IPCOM000119412D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Related People

Bonnell, RE: AUTHOR [+2]

Abstract

Disclosed is a mixed interconnect packaging technology which combines the advantages of both a plastic quad flat pack component with a solder ball connect (SBC) module.

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This is the abbreviated version, containing approximately 100% of the total text.

Mixed Gull Wing / Solder Ball Connect Module for Surface Mount Technology

      Disclosed is a mixed interconnect packaging technology which
combines the advantages of both a plastic quad flat pack component
with a solder ball connect (SBC) module.

      The disclosed package takes a ceramic solder ball connect
module with the outer rows of balls replaced with a standard fine
pitch gull wing lead frame to the periphery of the device, see figure
below.  There are a number of methods to attach the lead frame to the
ceramic, such as brazing, solder hierarchy or welding.  The outer
lead frame could be added to modules of virtually any size (40 to 64
mm or greater) and would provide capability for increased lead count
without increasing the card cost to achieve the necessary density for
the same lead count in a 25 mil array of SBC.

      The gull wing lead pitch can be varied to achieve the I/O count
desired.

      Disclosed anonymously.