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Hot Tape Lift-Off Process

IP.com Disclosure Number: IPCOM000119435D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 1 page(s) / 31K

Publishing Venue

IBM

Related People

Lynch, JD: AUTHOR [+4]

Abstract

Tape removal of material deposited on a thermoplastic photoresist pattern is made possible by heating before pulling the tape. This process is especially useful when large plates of the deposited material must be lifted off and solvent lift-off processing is difficult or impossible.

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Hot Tape Lift-Off Process

      Tape removal of material deposited on a thermoplastic
photoresist pattern is made possible by heating before pulling the
tape.  This  process is especially useful when large plates of the
deposited material must be lifted off and solvent lift-off processing
is difficult or impossible.

      A thermoplastic photoresist, e.g., most common novolak based
positive photoresists, is patterned, developed, and baked in a
standard process for lift-off, wherein edges of the pattern are
recursive (undercut).  Then, a thin film of material is vacuum
deposited.  A kapton or other heat resistant tape having an adhesive
which is not softened by heat is applied and stuck firmly to the
vacuum deposited material.  The tape is removed after heat has been
applied to raise the photoresist to its softening or melting point -
usually in the range of 80 to 130 degrees centigrade.  All of the
material which was deposited on the pattern of photoresist is cleanly
removed while material deposited elsewhere remains in a desired
pattern.  Residual photoresist is removed by an appropriate solvent
or by an ashing process.

      Disclosed anonymously.