Browse Prior Art Database

Low Profile Packaging Method

IP.com Disclosure Number: IPCOM000119438D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 1 page(s) / 42K

Publishing Venue

IBM

Related People

Nestork, WJ: AUTHOR

Abstract

A method of packaging electronic subassemblies is used to make a low profile total package, e.g., a personal computer, having desirable heat dissipation and electrical characteristics and low assembly cost.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 99% of the total text.

Low Profile Packaging Method

      A method of packaging electronic subassemblies is used to make
a low profile total package, e.g., a personal computer, having
desirable heat dissipation and electrical characteristics and low
assembly cost.

      Referring to the figure, printed circuit card (PCC) 2 having
electrical components 4 mounted on its top side and integrated
circuit chips 6 directly attached to its underside is inserted in a
slot in molded plastic base 8, pressed downward and retained in place
by means, e.g., a turn buckle or snap lock 10.  Elastomer conductor
bridge 12 is pressed into a slot in base 8, makes contact with lines
on the underside of PCC 2, and connects to adjacent circuitry 14.
Thermally conductive medium 16, e.g., a gum or grease which is an
electrical insulator, conducts heat from the back side of chips 6 to
metal insert 18.  Gasket 20 serves to seal the slot and to maintain
lateral pressure on PCC 2 for proper location against the base of
retention mechanism 10.  Sealing other edges of PCC 2 to prevent
exposure of chips 6 to dirt and water is achieved by means of
elastomer bridges 12 having flexible conductive lines on their
surface where needed.

      Low cost assembly is derived from this press-in and
snap-into-place methodology.  Thermal transmission from protected
circuit chips to surrounding environment is very good, thereby making
dense packaging possible, thus keeping electrical line length short.

      Disclosed an...