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Browse Prior Art Database

Burn-Off Etching Stencil

IP.com Disclosure Number: IPCOM000119462D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 1 page(s) / 52K

Publishing Venue

IBM

Related People

Feger, C: AUTHOR [+3]

Abstract

Etching and other fabrication processes often require the application and subsequent removal of a mask. A wide variety of masking systems are used in microelectronic manufacture. These are frequently photoresists or screenable resists which are removed by organic solvents or other developers after the etching step is complete, often with considerable difficulty. Because of these difficulties there are many instances where an alternative resist removal procedure would be desirable for either engineering or economic reasons. Disclosed here is a resist concept that utilizes thermal depolymerization and volatilization as the method of resist mask removal.

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Burn-Off Etching Stencil

      Etching and other fabrication processes often require the
application and subsequent removal of a mask.  A wide variety of
masking systems are used in microelectronic manufacture.  These are
frequently photoresists or screenable resists which are removed by
organic solvents or other developers after the etching step is
complete, often with considerable difficulty.  Because of these
difficulties there are many instances where an alternative resist
removal procedure would be desirable for either engineering or
economic reasons.  Disclosed here is a resist concept that utilizes
thermal depolymerization and volatilization as the method of resist
mask removal.

      Thermally depolymerizable polymers can be used as etch masking
materials to great advantage over ordinary mask materials in
processes where a high temperature heating step can conveniently
follow the etching step.  In this method the etch mask material is
applied to the surface of the material to be etched, the etching
process is carried out and the part is then heated to a temperature
above the mask material's ceiling temperature to induce
depolymerization and vaporization of the mask which leaves a clean
surface of the etched material exposed.  The ceiling temperature,
roughly, is the temperature at which the rates of polymerization and
depolymerization are equal.  Thus, when a film of this material is
heated to a temperature significantly above this, quantitative
degr...