Browse Prior Art Database

Metal Foil With Via Holes Covered With Elastomeric Insulator

IP.com Disclosure Number: IPCOM000119474D
Original Publication Date: 1991-Jan-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 1 page(s) / 31K

Publishing Venue

IBM

Related People

Grube, GW: AUTHOR [+4]

Abstract

Disclosed is a method of producing conducting ground planes insulated from circuit wires, with conducting wire through-holes in the ground plane.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Metal Foil With Via Holes Covered With Elastomeric Insulator

      Disclosed is a method of producing conducting ground planes
insulated from circuit wires, with conducting wire through-holes in
the ground plane.

      We have found that screening an elastomeric polymer on a
punched sheet, followed by vacuum suction, can produce uniformly
coated sidewalls on the via holes.

      The cross sections of such vias are sketched below. The top
Fig. shows the metal ground plane 1 with via holes 2 covered by a
uniform plane of elastomer 3.  The edges of the metal are grasped,
and a slight vacuum is pulled while the holes are observed to open as
in the bottom Fig.  The elastomer 3 is then cured with uv light, and
the process is repeated on the other side.  If the absorption depth
of the uv light is less than the metal thickness, the non-uniform
elastomer on the bottom side of the metal will not be cured and will
be planarized in the next screening step.

      Disclosed anonymously.