Browse Prior Art Database

Retention Device for Connector Subassembly

IP.com Disclosure Number: IPCOM000119554D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 3 page(s) / 125K

Publishing Venue

IBM

Related People

Davidge, RV: AUTHOR

Abstract

This article describes a connector configured to make multiple electrical connections between electronic circuits and placed atop a spacer to control its distance from a circuit board.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Retention Device for Connector Subassembly

      This article describes a connector configured to make
multiple electrical connections between electronic circuits and
placed atop a spacer to control its distance from a circuit board.

      Connectors such as the AMP-HDI* high density interconnector can
be used to make electrical connections between circuit boards.
Connections thus made consist of a header connector, which contains a
number of conductive pins, and a receptacle connector, which contains
a number of flexible conductive surfaces configured to grip these
pins so that electrical and mechanical connections are made. Circuit
leads extending from, or integral with, these pins and receptacles,
are soldered to circuit areas within the circuit board.

      It is often desirable to control the spacing between the
circuit boards thus connected by placing a spacer under one of the
connectors.  Such spacers are supplied by AMP Incorporated, for use
with their AMP-HDI connector systems. These spacers have holes
through which the circuit leads extend.  For use with such a spacer,
the circuit leads are available in various extended lengths.

      Connectors often are supplied with retention devices to assist
in the location of such connectors on circuit boards and to hold the
connectors in place before and during soldering operations.  This
function is particularly important because thermal gradients during
the soldering process often tend to warp components and circuit
boards so that they are separated, and because mechanical forces on
compon ents during this process often tend to float the components
away from the surface of the circuit board.  These retention devices
may be integral with the connector, or attached thereto before or
after the attachment of the connector to the circuit board.  Such a
device may include snap surfaces which are pressed together while the
device is passed through a hole, to subsequently separate so that
ledges on these surfaces hold the device in place extending through
the hole.

      The use of stand-offs using collapsible surfaces on one or both
ends has also been described in the prior art.

      In the drawings, Fig. 1 is a partial sectional side view of a
connector, a spacer, and a circuit board held together before
soldering by the retention device of this disclosure.  Fig. 2 is a
side view of the retention device. Fig. 3 is a view of the retention
device taken at an angle orthogonal to that of Fig. 2.

      Referring to Fig. 1, a connector 1, which may be either a pin
type or a receptacle type, and a spacer 2, are mounted on circuit
board 3.  Connector 1 includes a number of circuit leads 4, which
extend downward through holes (not shown) in spacer 2 and in circuit
board 3.  These circuit leads 4 are soldered to appropriate pads or
plated through holes in circuit board 3 to achieve mechanical
connection w...