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Browse Prior Art Database

Solder Repair Tool

IP.com Disclosure Number: IPCOM000119671D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 3 page(s) / 98K

Publishing Venue

IBM

Related People

Halliday, D: AUTHOR [+2]

Abstract

This article describes a high volume production tool for the removal and replacement of Pin Through Hole Components on SMT cards. Burning and delamination of printed circuit boards (PCB) is eliminated. A universal layout allows many differing PCB products to be reworked in an improved operation environment. Additional precision control is extended to contact-solder temperature, selected area exposed, and solder contact time. Component tool changing is quick and automatic. Exterior

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This is the abbreviated version, containing approximately 52% of the total text.

Solder Repair Tool

      This article describes a high volume production tool for
the removal and replacement of Pin Through Hole Components on SMT
cards.  Burning and delamination of printed circuit boards (PCB) is
eliminated.  A universal layout allows many differing PCB products to
be reworked in an improved operation environment.  Additional
precision control is extended to contact-solder temperature, selected
area exposed, and solder contact time.  Component tool changing is
quick and automatic.
Exterior

      A PCB solder repair workstation comprises a self-contained
floor- standing cabinet 1 in Fig. 1.  A bench-height working surface
2 occupies the top of the cabinet backed by a utility shelf 3 which
is supported by a storage rack 4 for snap-on locators 10 and a
control panel 5 for manual control of heaters, tool selection and
linear positioning.  On the top surface are the PCB panel holder 6,
linear positioner 7 (Fig. 1) of the solder tool 17 and an X-Y panel 8
used to position the the PCB (omitted for clarity) beneath the
component work point 20.  An automatic heat shutter interposed
between the solder source 17 and the PCB is linked to the interior
solder lift 16 for automatic removal when solder is raised. The
manually selected snap-on locator 10 is fitted to an overhead locator
arm 9.  Fume extractor 11 is also positioned immediately above
central work point 20. Projecting from the bottom of the cabinet 1 is
a foot-operated pedal control 12 to raise the interior solder lift 16
that is situated immediately below the central work point 20.  Hinged
panels 14 allow access to the interior sectors.  Referring to Fig. 2,
a drip tray 13 is positioned under solder sump 19.  The...