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Formed Metallized Polymer Film Contacts Providing Vias And Strain Relief

IP.com Disclosure Number: IPCOM000119698D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 3 page(s) / 83K

Publishing Venue

IBM

Related People

Cook, HC: AUTHOR [+3]

Abstract

Described is a technique for producing vias and contact leads having strain relief properties on thin polymer metallized films utilized for interconnecting integrated circuit chips with substrates or circuit boards. Areas of the metallized flexible film are pierced and formed to provide rolled-over contacts that may be soldered or bonded to a substrate or to a circuit board.

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Formed Metallized Polymer Film Contacts Providing Vias And Strain
Relief

      Described is a technique for producing vias and contact
leads having strain relief properties on thin polymer metallized
films utilized for interconnecting integrated circuit chips with
substrates or circuit boards.  Areas of the metallized flexible film
are pierced and formed to provide rolled-over contacts that may be
soldered or bonded to a substrate or to a circuit board.

      Figs. 1A-1C illustrate the piercing and forming tool and the
forming of a via.  In Fig. 1A, a polyimide film 1 has a metallized
stripe area 2 of copper, aluminum or the like, that is to serve as a
contact lead.  It should be understood that one end of the
metallization would be soldered or connected to an integrated circuit
chip or component and the end near the tool 4 is to be formed into
a contact area.  Tool 4 pierces a hole or via 3 in the film 1.
An angular relief of approximately 5 degrees on the nose of the tool
and the sloped flat rear edge 5 of the tool 4 can be used in
combination with a support fixture (not shown) to allow the tool 4 to
bend the metallization 2 into a curved or rolled segment as the tool
pierces the film, as shown in Fig. 1B.  In Fig. 1C, the contact 6 is
completely formed with the angled flat edge of tool 4, pushing and
rolling the metallized area as the via or hole 3 is enlarged.  The
polyimide film 1 strips and tears along the lines of metallization 2.
The polyimide film 1...