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Solder Ball Module Stabilizer

IP.com Disclosure Number: IPCOM000119719D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Gruber, HW: AUTHOR [+3]

Abstract

To prevent solder ball connected (SBC) modules from collapsing and the various balls from short-circuiting each other, a stabilizer ring of solderable metal-like copper is formed comprising buckets for the solder balls. This ring shorts all power solder balls that are arranged in series to form a rectangle or circle. Each bucket is provided with an opening at the bottom, so that the solder can get out onto the pads to which one of the power levels is connected.

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This is the abbreviated version, containing approximately 100% of the total text.

Solder Ball Module Stabilizer

      To prevent solder ball connected (SBC) modules from
collapsing and the various balls from short-circuiting each other, a
stabilizer ring of solderable metal-like copper is formed comprising
buckets for the solder balls.  This ring shorts all power solder
balls that are arranged in series to form a rectangle or circle.
Each bucket is provided with an opening at the bottom, so that the
solder can get out onto the pads to which one of the power levels is
connected.

      The stabilizer ring retains the module in a defined position at
a predetermined distance from the card surface. It shorts the
interconnections of one power level in parallel, thus improving the
electrical performance of the power distribution.  It can be used to
stop the solder from being sucked up by a via in the solder pad on
the card, if the openings in the buckets are offset to those in the
card pads.  A further advantage is that heat sink weight does not
lead to collapse and short-circuiting.

                            (Image Omitted)

      The stabilizer ring is manufactured by a multi-function punch
which is also used to punch the buckets and the openings contained
therein.