Browse Prior Art Database

Integrated EMI Grounding Spring

IP.com Disclosure Number: IPCOM000119734D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 39K

Publishing Venue

IBM

Related People

Davis, JH: AUTHOR [+2]

Abstract

This invention improves the EMI performances of products which have I/O connectors by ensuring the intimate contact of the connector shell with the key grounding points of the product.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Integrated EMI Grounding Spring

      This invention improves the EMI performances of products which
have I/O connectors by ensuring the intimate contact of the connector
shell with the key grounding points of the product.

      This invention demonstrates that the shell of all I/O
connectors must be in excellent contact with the Electromagnetic
Interference (EMI) covers to reduce the COMMON MODE VOLTAGE ON THE
I/O CABLE SHIELD.  The Figure shows an implementation of the EMI
Integrated Grounding Spring. This spring uses extensions (2) and (7)
to make contacts from the I/O connector shell (3) to the EMI covers
(1) with multiple fingerstock.  It also contacts at (5) the frame
grounding (4) which in turn is in contact with the PC card (6)
ground.  This Grounding Spring ties the connector and cable shield to
all the important noise reducing grounds.

      Disclosed anonymously.