Browse Prior Art Database

Package for Common Mode Toroid

IP.com Disclosure Number: IPCOM000119736D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 24K

Publishing Venue

IBM

Related People

Clarkson, RD: AUTHOR [+2]

Abstract

Disclosed is a method for fabrication and assembly of a common mode toroid for use on a printed circuit board.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Package for Common Mode Toroid

      Disclosed is a method for fabrication and assembly of a common
mode toroid for use on a printed circuit board.

      A common mode toroid can be assembled using two pieces of core
material with coils wound or assembled to the lower piece, as shown
in the figure.  All coils are wound in the same direction.
Insulating material is added to encapsulate the parts.

                            (Image Omitted)

      This package gives some advantages over any available
components.  The low profile and narrow package saves space. The
component leads are short. More coils can be added by extending the
length.  No solder connections are necessary inside this component.
This simple assembly uses few parts so the component cost can be low.

      Disclosed anonymously.