Browse Prior Art Database

Damascene Test Pad Structure

IP.com Disclosure Number: IPCOM000119748D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 43K

Publishing Venue

IBM

Related People

Cronin, JE: AUTHOR

Abstract

By designing probe test pads to be comprised of a number of parallel connected conductive stripes, large area pad damage during polishing in the damascene line formation process is avoided. This technique is found most necessary when thin metal is specified for the damascene lines.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Damascene Test Pad Structure

      By designing probe test pads to be comprised of a number of
parallel connected conductive stripes, large area pad damage during
polishing in the damascene line formation process is avoided.  This
technique is found most necessary when thin metal is specified for
the damascene lines.

      Referring to the figure, a probe pad is designed to have
conductive lines 2 connected at their ends to shorting conductors 4.
Connector line 6 to a circuit test point is connected to a shorting
conductor 4.

      The length dimension of lines in test pads is preferably
designed to be disposed orthogonally to the direction of sliding
motion of test probes.  Probe damage to pad lines resulting in no
probe contact to a pad is avoided by this orientation of pad lines
relative to probe motion.

      Disclosed anonymously.