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Browse Prior Art Database

ILB Support Pad and Plating Uniformity Enhancement Structure

IP.com Disclosure Number: IPCOM000119751D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 33K

Publishing Venue

IBM

Related People

Atkinson, JM: AUTHOR [+9]

Abstract

The inner leads of a flexible film chip carrier are extended inward and attached to a support pad. This support pad has a dual function. It provides mechanical support for the inner leads and thereby prevents lead bending and other handling damage during processing. It also provides a surface area for dummy circuitry which acts as a plating thief and enhances the thickness uniformity of the inner leads during the copper plating operation. The support pad would be excised prior to the IC chip bonding operation.

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ILB Support Pad and Plating Uniformity Enhancement Structure

      The inner leads of a flexible film chip carrier are extended
inward and attached to a support pad.  This support pad has a dual
function.  It provides mechanical support for the inner leads and
thereby prevents lead bending and other handling damage during
processing.  It also provides a surface area for dummy circuitry
which acts as a plating thief and enhances the thickness uniformity
of the inner leads during the copper plating operation.  The support
pad would be excised prior to the IC chip bonding operation.

      Figure 1a shows the inner lead area of a flexible film chip
carrier without a support pad.  Inner leads 1 are cantilevers
extending into open space 2.

      Figure 1b shows the same carrier with inner leads 1 extended to
support pad 3 across open space 2.

      Disclosed anonymously.