Browse Prior Art Database

Flex Interconnect Between Transistor/Diode Leads and Ceramic Substrate

IP.com Disclosure Number: IPCOM000119752D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 39K

Publishing Venue

IBM

Related People

Lasky, KA: AUTHOR [+3]

Abstract

Disclosed is a design that allows a connection between rigid leaded devices and ceramic substrates using a flexible interconnect circuit. This circuit, being extremely compliant, allows the joining of components with rigid leads to substrates, ceram- ic, or FR-4 (Fig. 1). Without the flex interconnect, thermal mismatch between the leaded packages and the substrate causes solder joints to fail as a result of high strains during thermal cycling. In addition, the forming of the leads for the soldering process often causes cracking of the hermetic glass seal that isolates the leads from the package (Fig. 2). Using a flex circuit as an interconnection between the package and the substrate, eliminates these failure modes for the following reasons.

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Flex Interconnect Between Transistor/Diode Leads and Ceramic Substrate

      Disclosed is a design that allows a connection between rigid
leaded devices and ceramic substrates using a flexible interconnect
circuit.  This circuit, being extremely compliant, allows the joining
of components with rigid leads to substrates, ceram- ic, or FR-4
(Fig. 1).  Without the flex interconnect, thermal mismatch between
the leaded packages and the substrate causes solder joints to fail as
a result of high strains during thermal cycling.  In addition, the
forming of the leads for the soldering process often causes cracking
of the hermetic glass seal that isolates the leads from the package
(Fig. 2).  Using a flex circuit as an interconnection between the
package and the substrate, eliminates these failure modes for the
following reasons. First, because of its flexibility (compliant
nature), the strains on the solder joints are substantially reduced,
and in turn, the joint reliability is greatly improved.  Second, the
glass seal cracking is avoided because no lead forming is required.

      Disclosed anonymously.