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A Method for Eliminating Leading Edge Via Pitting in a Multiple Pass Thick Film Deposition Process

IP.com Disclosure Number: IPCOM000119759D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 47K

Publishing Venue

IBM

Related People

Andris, GS: AUTHOR [+2]

Abstract

Disclosed is a manufacturing method for eliminating leading edge via pits in a multiple pass thick film deposition process. A unique starting position is required to ensure constant and continuous flow of a thick film paste when reusing a screening mask before cleaning. The unique starting position must be on a clean section of a screening mask so that adequate paste flow is achieved before plowing into previously deposited thick film paste.

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A Method for Eliminating Leading Edge Via Pitting in a Multiple Pass
Thick Film Deposition Process

      Disclosed is a manufacturing method for eliminating leading
edge via pits in a multiple pass thick film deposition process.  A
unique starting position is required to ensure constant and
continuous flow of a thick film paste when reusing a screening mask
before cleaning.  The unique starting position must be on a clean
section of a screening mask so that adequate paste flow is achieved
before plowing into previously deposited thick film paste.

      In the figure, a conductive paste carrier 2 is supported by
structure 1.  A screening mask 4, held in position by a mounting
frame 3, is used to deposit a unique thick film paste pattern onto
the conductive paste carrier 2.  After the first thick film
deposition process, a residual film of thick film paste 5 remains on
the screening mask 4 until a second pattern is printed on a second
conductive paste carrier 2.

      Prior thick film paste application methods with an already used
screening mask 4 had the same paste nozzle start location as the
previous thick film operation 6.  This thick film application process
resulted in leading edge via pits only on the conductive paste
carriers which were screened with an already used screening mask 4.

      The new disclosed method for eliminating via pits on a
conductive paste carrier 2 in a multiple pass thick film process is
to have a unique starting position...