Browse Prior Art Database

TCM Chip Interposer

IP.com Disclosure Number: IPCOM000119764D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 57K

Publishing Venue

IBM

Related People

Abrami, AJ: AUTHOR [+2]

Abstract

TCM design is faced with an increasing problem of temperature spread from chip to chip due to varying individual powers on the substrate. Disclosed is a new method by which temperature of low power chips is increased. The temperature increase is accomplished by patterning laser markings on selected TCM chips to add a variable amount of thermal resistance. The marks are made or "burned in" on the backside of the chip by a laser marking tool, and because of the silicon molten process, the marks become part of the silicon chip surface. The marks then interpose the chip backside to the piston. In this way, the chip interposer adds thermal resistance to selected individual chip sites in proportion to the laser mark height and pattern. (Image Omitted)

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TCM Chip Interposer

      TCM design is faced with an increasing problem of temperature
spread from chip to chip due to varying individual powers on the
substrate.  Disclosed is a new method by which temperature of low
power chips is increased. The temperature increase is accomplished by
patterning laser markings on selected TCM chips to add a variable
amount of thermal resistance.  The marks are made or "burned in" on
the backside of the chip by a laser marking tool, and because of the
silicon molten process, the marks become part of the silicon chip
surface.  The marks then interpose the chip backside to the piston.
In this way, the chip interposer adds thermal resistance to selected
individual chip sites in proportion to the laser mark height and
pattern.

                            (Image Omitted)

      Disclosed anonymously.