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Browse Prior Art Database

Wire Bonded Chips Mounted to Dynamic Flex Cables (directly On Stiffener)

IP.com Disclosure Number: IPCOM000119771D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 25K

Publishing Venue

IBM

Related People

Christiansen, RA: AUTHOR [+4]

Abstract

Illustrated in the figure is a chip 1 which is placed in a well in the flex tape 5 so that it has direct contact through its adhesive 2 to the stiffener 4. The chip 1 is bonded to the stiffener 4 with a thermally conductive adhesive 2 and the chip 1 is connected to the flex circuit cable 5 by the wirebond 3. The assembly is encapsulated by encapsulating material 6. The materials are selected so that the coefficient of the linear expansion closely matches that of the wirebond material.

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This is the abbreviated version, containing approximately 100% of the total text.

Wire Bonded Chips Mounted to Dynamic Flex Cables (directly On Stiffener)

      Illustrated in the figure is a chip 1 which is placed in a well
in the flex tape 5 so that it has direct contact through its adhesive
2 to the stiffener 4.  The chip 1 is bonded to the stiffener 4 with
a thermally conductive adhesive 2 and the chip 1 is connected to the
flex circuit cable 5 by the wirebond 3.  The assembly is encapsulated
by encapsulating material 6.  The materials are selected so that the
coefficient of the linear expansion closely matches that of the
wirebond material.

      Disclosed anonymously.