Browse Prior Art Database

Method for Holding Single In-Line Package Modules to Card Before Solder

IP.com Disclosure Number: IPCOM000119776D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 23K

Publishing Venue

IBM

Related People

Kane Jr, PH: AUTHOR

Abstract

Disclosed is a method of holding Single In-line Packages (SIPs) to a circuit card prior to being soldered to prevent them from tilting or falling off during assembly. It involves crimping the leads of the SIP after they are placed on the card. (Image Omitted)

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Method for Holding Single In-Line Package Modules to Card Before
Solder

      Disclosed is a method of holding Single In-line Packages (SIPs)
to a circuit card prior to being soldered to prevent them from
tilting or falling off during assembly.  It involves crimping the
leads of the SIP after they are placed on the card.

                            (Image Omitted)

      The solution is to crimp the leads of the SIP after it is
placed on the card.  The first two leads should be crimped along with
one more lead to hold longer SIPS in place (the figure illustrates
the idea).  The SIP 1 can be any number of leads including two lead
SIPs.  The SIP is inserted through the card 2 and then crimped 3 just
enough to keep the SIP from slipping back out through the holes in
the card.

      Disclosed anonymously.