Browse Prior Art Database

Polishing Carrier Design

IP.com Disclosure Number: IPCOM000119871D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Burke, PA: AUTHOR [+4]

Abstract

This wafer carrier design has vertical holes for vacuum pick-up and pressure release. The carrier is of two-piece construction allowing access to both sides of vertical holes during wafer backing film application. The design results in a carrier having a mounted wafer backing film with excellent planarity in the vicinity of holes.

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This is the abbreviated version, containing approximately 84% of the total text.

Polishing Carrier Design

      This wafer carrier design has vertical holes for vacuum
pick-up and pressure release.  The carrier is of two-piece
construction allowing access to both sides of vertical holes during
wafer backing film application.  The design results in a carrier
having a mounted wafer backing film with excellent planarity in the
vicinity of holes.

      Referring to the cross-section (Fig 1), the wafer carrier base
10 has pump-out and release hole 12 in the center and retainer ring
14 mounted on the edge.  Plenum plate 16 has vertical through-holes
18 in channels radiating outward from center and is mounted with a
vacuum and pressure seal to base 10.  Fig. 2 is a top view of plenum
plate 16.  Wafer backing film 20 has hole openings that coincide with
the size and location of holes 18.  Vacuum is provided to pick up and
hold wafer 22 through holes 18 in the channels of plate 16 and hole
12 in base 10.  Vacuum may be released and pressure may be applied
through the same route of holes and channels during polishing or to
release wafer 22.

      Using precision hole location for holes 18, wafer backing film
20 may be pre-punched in a template and mounted using pin locators in
holes 18 to make holes in film 20 exactly match the position of holes
18.  An alternative is to first mount unpunched backing film 20 and
then make holes in film 20 by any of several means using holes 18 in
plate 16 as the template.

      In either case, holes in...