Browse Prior Art Database

Josephson Technology 3-Dimensional Package

IP.com Disclosure Number: IPCOM000119883D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 3 page(s) / 91K

Publishing Venue

IBM

Related People

Herrell, DJ: AUTHOR

Abstract

A 3-dimensional packaging arrangement for Josephson technology circuit chips is described in which pinless connectors (such as liquid Hg connectors) are used. Circuit chips are located on a carrier board, which is mounted transversely to a board carrying wiring modules. Circular edge connectors are used to make right angle transitions to the circuit-carrying cards and to the wiring modules. All alignment references are taken from a single machined block of suitable material, such as silicon. An I/O cable arrangement directly connects to pinless rods.

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This is the abbreviated version, containing approximately 55% of the total text.

Josephson Technology 3-Dimensional Package

      A 3-dimensional packaging arrangement for Josephson
technology circuit chips is described in which pinless connectors
(such as liquid Hg connectors) are used.  Circuit chips are located
on a carrier board, which is mounted transversely to a board carrying
wiring modules.  Circular edge connectors are used to make right
angle transitions to the circuit-carrying cards and to the wiring
modules.  All alignment references are taken from a single machined
block of suitable material, such as silicon.  An I/O cable
arrangement directly connects to pinless rods.

      Fig. 1 is a side sectional view of a portion of the package, in
which a machined silicon block 10 accommodates the circuit carrier
cards 12, having circuit chips 14 held thereon.  Wiring modules 16
are located in a plane transverse to the plane of the circuit
carriers 12, also being aligned and fastened to the silicon block 10.
Electrical connection between wiring module 16 and the circuit
carriers 12 is accomplished by the edge-connector rods 18.  These are
circular rods having a superconducting groundplane insulated from
wiring which bridges the circuit cards 12 and the wiring module 16.

      Fig. 2 is a perspective view of a portion of the packaging
arrangement which shows in more detail the fastening of the circuit
carriers 12 and the edge connectors 18.  Only a portion of the wiring
module 16 is shown in this view.  A plurality of slots 20 is...