Browse Prior Art Database

IC Socket With IC Removal Mechanism

IP.com Disclosure Number: IPCOM000119924D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 69K

Publishing Venue

IBM

Related People

Osada, A: AUTHOR [+2]

Abstract

Disclosed is an IC socket provided with a mechanism for easy and damageless IC removal.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

IC Socket With IC Removal Mechanism

      Disclosed is an IC socket provided with a mechanism for
easy and damageless IC removal.

      To remove a high I/O pin density IC from a socket, relatively
strong force is required, often resulting in mechanical damage, such
as bending of pins, IC crack and socket damage.

      The present socket consists of three pieces, socket member 10,
plate 12 and screw 14, as shown in Figs. 1 and 2. Fig. 1 shows
an example in which IC component 16, without pins, is attached to the
socket provided on circuit board 18, and Fig. 2 shows another example
in which IC component 16, with pins, is attached to the socket.

      Before attaching the IC 16, the plate 12 is placed in the
cavity of the socket member 10 and then the IC 16 is mounted on the
socket member 10.  When the IC 16 is to be removed, the screw 14 is
inserted into hole 20 of the board 18 and then into tapped hole 22 of
the socket member 10.  Turning the screw 14, the plate 12 is pushed
up to thereby remove the IC 16 from the socket.  The plate 12
contributes to equalize the pressure to the bottom surface of the IC
16 to protect it from mechanical damage.