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Decoupling Capacitor Incorporated in Printed Circuit Board

IP.com Disclosure Number: IPCOM000119966D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 26K

Publishing Venue

IBM

Related People

Itakura, K: AUTHOR [+3]

Abstract

Described is a method for forming a decoupling capacitor on a printed circuit board by selective etching of a copper foil of the board. (Image Omitted)

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Decoupling Capacitor Incorporated in Printed Circuit Board

      Described is a method for forming a decoupling capacitor
on a printed circuit board by selective etching of a copper foil of
the board.

                            (Image Omitted)

      In a typical process for the manufacture of printed circuit
boards, a copper clad laminate, comprising an insulating substrate
and copper foils bonded thereon, is used.  Wiring conductors are
formed by etching the copper foils in desired circuit patterns.  By
suitably etching the copper foils, decoupling capacitors can be
formed from the copper foils simultaneously with the formation of the
wiring conductors.  The capacitor may take any etched pattern such as
shown above.  Such capacitor may also be formed in the internal
wiring level of a multi-level printed circuit board in a similar
manner.