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Method for Improving Adhesion Between Polyimide And Epoxy by Ashing

IP.com Disclosure Number: IPCOM000119970D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 21K

Publishing Venue

IBM

Related People

Ishida, K: AUTHOR [+4]

Abstract

Polyimide can be used to form protective coatings on semiconductor chips. However, polyimide does not have sufficient adhesion to epoxy which is used as a molding compound or encapsulant for sealing the chips in the manufacture of circuit packages or modules. As a result, serious problems, such as package cracks, may occur when polyimide- coated chips are encapsulated with epoxy.

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Method for Improving Adhesion Between Polyimide And Epoxy by Ashing

      Polyimide can be used to form protective coatings on
semiconductor chips.  However, polyimide does not have sufficient
adhesion to epoxy which is used as a molding compound or encapsulant
for sealing the chips in the manufacture of circuit packages or
modules. As a result, serious problems, such as package cracks, may
occur when polyimide- coated chips are encapsulated with epoxy.

      It has been found that the problems can be solved by subjecting
the polyimide surface to oxygen plasma ashing which is conventionally
used for removal of photoresists. The ashing increases the number of
C=O bonds in the polyimide surface and enhances the adhesion between
the polyimide coating and the epoxy sealant by a factor of around 2.