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Browse Prior Art Database

Jet Impingement Onto TCM Piston for Heat Transfer And Thermal Protection of Electronic Circuits

IP.com Disclosure Number: IPCOM000119971D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 3 page(s) / 103K

Publishing Venue

IBM

Related People

Zumbrunnen, ML: AUTHOR

Abstract

This article describes a new cooling concept which combines the features of immersion cooling with conduction cooling of a TCM into one package. The immersion aspects of the design yield high performance cooling, whereas the conduction features are for thermal protection during impaired or loss of cooling. Disclosed are means which provide adequate cooling to each chip so that catastrophic failure will never occur, and which lengthen the thermal transient behavior of the chip so that a problem may be sensed.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Jet Impingement Onto TCM Piston for Heat Transfer And Thermal Protection
of Electronic Circuits

      This article describes a new cooling concept which
combines the features of immersion cooling with conduction cooling of
a TCM into one package.  The immersion aspects of the design yield
high performance cooling, whereas the conduction features are for
thermal protection during impaired or loss of cooling.  Disclosed are
means which provide adequate cooling to each chip so that
catastrophic failure will never occur, and which lengthen the thermal
transient behavior of the chip so that a problem may be sensed.

      A single chip site of this new cooling concept is illustrated
in Fig. 1.  The major elements consist of a piston 1, supply manifold
channels 2, jet nozzles 3, and a thermal capacitance block/cold plate
combination 4.  The thermal capacitance block/cold plate is attached
to the upper portion of the supply manifold.  This part provides
additional cooling during normal operation and increased capacitance
during emergencies.  The part can be filled with a Phase Change
Material (PCM), such as paraffin. The top view illustrates an
"elliptical" shaped hole having a small gap 6 for the conduction
portion of the piston and a large gap portion 5 for the jet.  The
piston is cooled in part by the jets 3 impinging onto region 5 and by
piston engagement in a hat for conduction cooling 6.  The conduction
portion of the piston is sized for proper clearance between the
piston and the receiving hole located in the supply manifold.  A
small radial gap is desired for a low resistance of the conduction
path.  The impingement portion of the piston can be smooth or can
have axial fins 7 for extended surface.  The larger gap is determined
for optimum jet diameter (D sub j) to free length spacing L, given
allowances for pressure drop and manufacturing tolerances.

      Under normal operating conditions, the coolant is supplied via
the channels to an array of jets for impingement onto the perimeter
of the pistons.  The majority of the heat generated by the chips is
dissipat...