Browse Prior Art Database

High Temperature Press Pad for Flat-Bed Lamination

IP.com Disclosure Number: IPCOM000119973D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Czebiniak, PT: AUTHOR [+4]

Abstract

Disclosed is a new press pad for use during high temperature and high pressure lamination. During flat-bed lamination of circuit board composites at very high temperatures and pressures (700-750 F and 1000- 2000 psi), platen deflection during lamination causes problems with part planarity and induces pressure non-uniformities. If the laminated part is much smaller than the platen, then with repeated lamination cycles, the platen deflection causes significant thickness variations in the part.

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High Temperature Press Pad for Flat-Bed Lamination

      Disclosed is a new press pad for use during high
temperature and high pressure lamination.  During flat-bed lamination
of circuit board composites at very high temperatures and pressures
(700-750 F and 1000- 2000 psi), platen deflection during lamination
causes problems with part planarity and induces pressure
non-uniformities.  If the laminated part is much smaller than the
platen, then with repeated lamination cycles, the platen deflection
causes significant thickness variations in the part.

      Given that the platen deflection is a function of the stiffness
of the platens, the insulation material between the platen and the
press frame, and the rigidity of the press frame, a means was needed
to compensate for the platen non-planarity.  A new composite press
pad was invented which provides uniform pressure and significantly
reduces thickness variations during lamination.

      The press pad disclosed here reduces the thickness variation by
over 50 percent, when measured using a 0.040-inch thick test panel.
For example, a 10 by 15 inch test vehicle laminated without using the
composite press pad had a maximum thickness variation of 0.0142 inch
across the panel.  When the composite pad was used, the maximum
thickness variation was reduced to 0.0066 inch.  In both of these
cases, the lamination pressure was 1700 psi at a platen temperature
of 730 F.

      The composite press pad (see figure) co...