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Browse Prior Art Database

Flatpack Package Using Core Metal Layer of Composite Substrate As Ground Plane

IP.com Disclosure Number: IPCOM000119979D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Ishida, K: AUTHOR

Abstract

Disclosed is a flatpack package in which a chip is placed in an opening formed in a composite substrate to expose the core metal layer of the substrate and the metal layer is used as a ground plane.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Flatpack Package Using Core Metal Layer of Composite Substrate As
Ground Plane

      Disclosed is a flatpack package in which a chip is placed
in an opening formed in a composite substrate to expose the core
metal layer of the substrate and the metal layer is used as a ground
plane.

      Fig. 1 shows the present package.  Chip 10 is placed in opening
12 formed in composite substrate 14 which includes core metal layer
16 in an insulating material.  The opening 12 exposes the metal layer
16, and the chip is bonded to the metal layer 16 by epoxy adhesive.
As shown in Figs. 1 and 2, the upper surface of the substrate
provides a first wiring level which may include signal, power and
ground conductors.  The metal layer 16 provides a second wiring level
which may include a ground plane, signal leads, ground leads 22 and
power leads 24.  The ground leads 22 are connected to the ground
plane. The lower surface of the substrate provides a third wiring
level which is used only as a power plane.  Ground pads on the chip
10 are connected to ground conductors in the first wiring level by
gold wires 18 and then through plated through holes 20 to the ground
leads 22.  The power plane is also coupled to the power leads 24 and
power pads on the chip 10 through other through holes.  Selected
portions of the surface conductors are coated by solder resist 26.
The chip is encapsulated with molding epoxy 28.