Browse Prior Art Database

Stress Relief Method for Tab Modules

IP.com Disclosure Number: IPCOM000120045D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Nishiyama, K: AUTHOR [+2]

Abstract

Described is a method for blocking stress transmission from a TAB (Tape Automated Bonding) outer lead area to an inner lead area by providing a rectangular slit 12 in the TAB tape 10 (Fig. 1).

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This is the abbreviated version, containing approximately 100% of the total text.

Stress Relief Method for Tab Modules

      Described is a method for blocking stress transmission
from a TAB (Tape Automated Bonding) outer lead area to an inner lead
area by providing a rectangular slit 12 in the TAB tape 10 (Fig. 1).

      The TAB tape 10 usually comprises an insulating layer and a
conductive layer bonded to the insulating layer.  The conductive
layer is used to form inner and outer leads.  The TAB tape undergoes
stress due to heat during the TAB assembly process, resulting in a
warp or deformation in the tape 10, as shown in Fig. 3.  This not
only makes tape handling and positioning difficult but causes a
breakage or separation 18 between the tape 10 and the edge of resin
encapsulant 16 (Fig. 4) when the tape is handled by a vacuum handling
unit 20 (Fig. 6) which exerts force to pull the tape in the
horizontal direction.

      The above problem can be solved by providing the rectangular
slit 12 in the insulating layer, which surrounds the sealed chip
region.  The slit 12 is preferably formed in the vicinity of the edge
of the encapsulant 16.  The slit 12 alleviates heat stress to the
chip region and prevents occurrence of the breakage 18 when the tape
is handled by the vacuum handling unit 20.