Browse Prior Art Database

Pre-Tinned Pin Solder Connection

IP.com Disclosure Number: IPCOM000120065D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 3 page(s) / 47K

Publishing Venue

IBM

Related People

Clark, FE: AUTHOR

Abstract

Disclosed is a new method of attaching a pin head to a donut on metalized ceramic substrates.

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This is the abbreviated version, containing approximately 100% of the total text.

Pre-Tinned Pin Solder Connection

      Disclosed is a new method of attaching a pin head to a
donut on metalized ceramic substrates.

      This method uses a pre-tinned pin to provide solder to form the
fillet between the pin head and the donut (Figure 1).

      The substrate is pinned using a pre-tinned pin, and in the
process of forming the pin head the solder on the pin is displaced
onto the donut (Figure 2).

      The substrate is then processed through a reflow furnace which
reflows the displaced solder and forms the fillet between the pin
head and the donut (Figure 3).

      Different methods can be used for reflow, such as fluxing the
part and then processing through a nitrogen furnace or processing
through a hydrogen furnace without flux.