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Use of High-Frequency Voltages to Enhance Plating Rates

IP.com Disclosure Number: IPCOM000120074D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Von Gutfeld, RJ: AUTHOR

Abstract

The growth of copper dendrites across open circuits has been previously described as a successful means for achieving copper circuit repair. The technique uses Joule heating from an AC current passing through the copper sulfate solution in which the circuit is immersed. In this article, Joule heating is utilized to enhance plating rates both for electroless and electrolytic solutions. Two parts, at least one of which is copper for a copper bearing solution are partially or completely immersed in the solution. An AC potential difference, preferably at a frequency in the range 10-1,000 kHz is applied between the two parts which are in close proximity. For electroless copper we have observed enhanced plating rates on the order of 3-4 times faster than that expected for solutions used under standard conditions, i.e.

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Use of High-Frequency Voltages to Enhance Plating Rates

      The growth of copper dendrites across open circuits has
been previously described as a successful means for achieving copper
circuit repair.  The technique uses Joule heating from an AC current
passing through the copper sulfate solution in which the circuit is
immersed.  In this article, Joule heating is utilized to enhance
plating rates both for electroless and electrolytic solutions.  Two
parts, at least one of which is copper for a copper bearing solution
are partially or completely immersed in the solution.  An AC
potential difference, preferably at a frequency in the range 10-1,000
kHz is applied between the two parts which are in close proximity.
For electroless copper we have observed enhanced plating rates on the
order of 3-4 times faster than that expected for solutions used under
standard conditions, i.e., as high as 15 microns/hour.  For
electrolytic copper, the parts must be kept in close proximity to
achieve enhanced plating while for electroless copper the requirement
is less stringent.  In the latter case, parts not connected
electrically but in the vicinity of the AC fields will also become
plated if activated.  The enhanced plating resulting from AC Joule
heating will also occur for a variety of solutions other than
electroless and electrolytic copper.  In general, the electrolytic
plating enhancement results whenever there is a shift in the rest
potential with increased temperature....