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Browse Prior Art Database

Solder Mask System With Visible Light/Laser Imaging Capability

IP.com Disclosure Number: IPCOM000120077D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 3 page(s) / 94K

Publishing Venue

IBM

Related People

Gelorme, J: AUTHOR [+5]

Abstract

This article describes a solder mask system which is compatible with visible light expose technologies.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Solder Mask System With Visible Light/Laser Imaging Capability

      This article describes a solder mask system which is
compatible with visible light expose technologies.

      Direct imaging (i.e., maskless) expose technology for printed
circuit production is desirable in that it holds promise for reducing
defects, cycle time and costs associated with the circuitization pro-
cess.  (1-5). Current direct imaging tools are based on scanning
argon ion lasers.  Recently, a new class of expose tools was
introduced which are based upon liquid crystal projection (6).  Both
of these tool sets utilize visible light to image the photosensitive
materials.  Therefore, a unique requirement of any material to be
compatible with these expose techniques is that it be imageable with
visible, as opposed to ultraviolet, light.

      In order to benefit from the increased registration accuracy,
higher resolution and inherent flexi-bility of these expose
technologies, new photosensitive materi-als are required.  Below is a
representative formulation of an epoxy-based solder mask system which
is easily imaged with visible light, and therefore compatible with
the above mentioned tools.  The preferred formulation is as follows:

      EPOXY RESINS:
   Bakelite Phenoxy Resin PKHC*................................ 30%
   Epirez 5183**............................................... 45%
   Epirez SU-8**............................................... 25%

      INITIATOR:
      Diphenyiodonium hexafluoroantimonate
      10 parts by weight

      SENSITIZER:
      1,8-Dimethoxy-9,10-bis (phenylethynyl) anthracene
      2 p...