Browse Prior Art Database

Integrated Emi Strip/Connection

IP.com Disclosure Number: IPCOM000120083D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Parks, HM: AUTHOR

Abstract

For computer enclosures where EMI/RFI emissions are to be contained to meet government standards, this disclosure is a method of integrating a seal without additional parts. Controlling electromagnetic emissions most often is a result of how well the case or cover is designed to eliminate "leaks". Emission seals are most commonly obtained, with varying success, by utilizing some type of gasket or finger stock to reduce the interface resistance of the joint.

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Integrated Emi Strip/Connection

      For computer enclosures where EMI/RFI emissions are to be
contained to meet government standards, this disclosure is a method
of integrating a seal without additional parts. Controlling
electromagnetic emissions most often is a result of how well the case
or cover is designed to eliminate "leaks".  Emission seals are most
commonly obtained, with varying success, by utilizing some type of
gasket or finger stock to reduce the interface resistance of the
joint.

      Joint interface resistance or electrical conductivity is a
function of several factors:
      (1)  Surface resistance of the flange portion of the
           joint.
      (2)  The conformability of the gasket to the flange.
      (3)  The amount of pressure on the gasket.
      (4)  The gasket's conductivity.

      This article offers a method of accomplishing an
electromagnetic emission seal for very little additional cost.  The
mating cover components have integrated locking conductive seals
tooled into parts as shown in Fig. 1A. Typical metal- and
conductive-coated plastic parts can incorporate this type
slide-to-lock concept.  The interlocking tabs and groove connection
for emission containment can also be configured to lock adjacent
parts together for mechanical assembly.

      In summary, the advantages of the integral EMI joint are:
      (1)  Can be built into the case components without secondary
operations...