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High-Density, Fine-Pitch Interconnection Strips With Redundancy

IP.com Disclosure Number: IPCOM000120094D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Mahmoud, IS: AUTHOR [+2]

Abstract

Disclosed is a system applicable to high density carriers which has pitches as close as 0.008" center to center. This will yield as much as a 125 contact per one inch of metal strip.

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This is the abbreviated version, containing approximately 100% of the total text.

High-Density, Fine-Pitch Interconnection Strips With Redundancy

      Disclosed is a system applicable to high density carriers
which has pitches as close as 0.008" center to center.  This will
yield as much as a 125 contact per one inch of metal strip.

      The system by which the interconnection is fabricated is as
follows:
      1.   Contact foils from one to two mil thick are punched as
shown in Fig. 1.
      2.   Interleaf the punched strips with a thermoplastic
dielectric and laminate under proper temperature and pressure as
shown in Fig. 2.
      3.   Cut/excise assembly at the scoring points as shown in Fig.
3.