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Browse Prior Art Database

Flagless Molded IC Package

IP.com Disclosure Number: IPCOM000120168D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 25K

Publishing Venue

IBM

Related People

Blackshear, ED: AUTHOR

Abstract

In a flagless molded IC package, the chip is directly backside bonded to depressed lead fingers using insulating adhesive tape. This allows reduced finished package size, lower chip stress due to chip-flag thermal mismatch, and lower package thermal resistance. It allows the use of conventional perimeter bond pad chips. Access to the chip active surface is not obstructed, and backside bias may be applied by introducing conductive adhesive over a controlled area.

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This is the abbreviated version, containing approximately 100% of the total text.

Flagless Molded IC Package

      In a flagless molded IC package, the chip is directly backside
bonded to depressed lead fingers using insulating adhesive tape.
This allows reduced finished package size, lower chip stress due to
chip-flag thermal mismatch, and lower package thermal resistance.  It
allows the use of conventional perimeter bond pad chips.  Access to
the chip active surface is not obstructed, and backside bias may be
applied by introducing conductive adhesive over a controlled area.

      Disclosed anonymously.