Browse Prior Art Database

Clog-Resistant Jet Impringement Flow Balancing Device

IP.com Disclosure Number: IPCOM000120177D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 58K

Publishing Venue

IBM

Related People

Anderson, TM: AUTHOR [+3]

Abstract

The concept uses a porous sheet prior to the jet plate to control the jet flow rate at each chip and filter the coolant immediately before entering the jet nozzle. Flow customization is accomplished by varying the thickness of the flow balancing device adjacent to the jet nozzles rather than customized drilling of jet holes. The holes diameters in the jet plate are uniformly sized to cool the highest powered chip. The thickness of the flow balance device at each chip site is determined by the heat transfer performance required for the specific chip power. The flow balance device is machined completely through over the site of a high powered chip, partly through over the site of a moderate power chip, and left intact over the site of a low power chip.

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Clog-Resistant Jet Impringement Flow Balancing Device

      The concept uses a porous sheet prior to the jet plate to
control the jet flow rate at each chip and filter the coolant
immediately before entering the jet nozzle.  Flow customization is
accomplished by varying the thickness of the flow balancing device
adjacent to the jet nozzles rather than customized drilling of jet
holes.  The holes diameters in the jet plate are uniformly sized to
cool the highest powered chip.  The thickness of the flow balance
device at each chip site is determined by the heat transfer
performance required for the specific chip power.  The flow balance
device is machined completely through over the site of a high powered
chip, partly through over the site of a moderate power chip, and left
intact over the site of a low power chip.  An additional feature of
the invention is the filtration quality of the raw porous material.
Particles suspended within the coolant are trapped just prior to the
jet nozzle.  Accumulation of particles on the flow balance device
will not affect performance because the fluid flow can spread around
the obstruction and proceed to the jet nozzle.

      The figure shows an electronic component cooling module
comprising a flow balance device 1, adjacent to a jet orifice plate
2.  Coolant under pressure flows from the jet plenum 3 through the
flow balance device 1, through the jet orifice plate 2, and onto the
chip 4 and substrate 5.

      Disclosed a...