Browse Prior Art Database

Transfer of Material for Resist Or for Insulation Using Resistive Ribbon Technology

IP.com Disclosure Number: IPCOM000120206D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 35K

Publishing Venue

IBM

Related People

Afzali-Ardakani, A: AUTHOR [+4]

Abstract

Disclosed is the application of resistive ribbon technology to transfer polymeric material to a substrate, resulting in a composite structure which can be used in packaging technology, as a resist for wet or dry etching of the substrate, or for lift off of a following layer.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Transfer of Material for Resist Or for Insulation Using Resistive
Ribbon Technology

      Disclosed is the application of resistive ribbon
technology to transfer polymeric material to a substrate, resulting
in a composite structure which can be used in packaging technology,
as a resist for wet or dry etching of the substrate, or for lift off
of a following layer.

      The construction of the transfer ribbon is shown in the figure
and in essence is the same as the resistive ribbon used in the IBM
QUIETWRITER* printer with the ink replaced by a polymeric material 1,
such as a soluble TEFLON**.  The writing head 2 transfers the
material 1 in a pattern to a substrate 5 by sending current through a
resistive layer 3 to a conductive layer 4.  The pattern can then be
used as is.  This avoids the need for the photoresist apply, expose,
and strip steps in normal semiconductor and packaging technology.

      The thickness of the material 1 which can be transferred is
about 2 microns.  The resolution of the print head is, at present, 25
microns.  However, the resolution could be much finer by making the
print heads smaller than necessary for normal printing.
*   Trademark of IBM Corp.
**  Trademark of E. I. du Pont de Nemours & Co.