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Browse Prior Art Database

Method for TAB Heatsink-to-Card Attachment

IP.com Disclosure Number: IPCOM000120284D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 59K

Publishing Venue

IBM

Related People

Villarreal, JG: AUTHOR [+2]

Abstract

The disclosure herein describes the process and use of a thermoplastic hot-melt adhesive applied to a metal heatsink for attachment to a printed circuit card. The process and material is unique for this application because it provides a flexible attachment with the ability to easily remove the heatsink if needed.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 60% of the total text.

Method for TAB Heatsink-to-Card Attachment

      The disclosure herein describes the process and use of a
thermoplastic hot-melt adhesive applied to a metal heatsink for
attachment to a printed circuit card.  The process and material is
unique for this application because it provides a flexible attachment
with the ability to easily remove the heatsink if needed.

      Previously, methods used to attach heatsinks to cards involved
using either mechanical devices, such as a metal clips or rivets
(plastic or metal), or permanent adhesives, such as epoxies.  Metal
clips and rivets attachment, because of manufacturing tolerances, are
subject to some degree of looseness which can cause damage of the
inner and outer leads of the TAB package.  Also, in some cases, holes
must be provided in the circuit card.  Permanent adhesives, while
protecting the TAB leads, are not easily removed if rework of the TAB
package is needed, and they usually have mixing, storage, safety, and
shelf life considerations.

      Hot-melt adhesives are basically thermoplastic materials with
modifiers to promote tack, adhesion, surface wetting, and thermal
stability.  They are heated to their melting point and applied as a
liquid.  As the adhesive cools, solidification occurs and the bond is
effected.

      The heatsink attachment method proposed herein begins by
applying a controlled amount of adhesive on the attachment point of
the aluminum heatsink.  Other metals can be used.  T...