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Browse Prior Art Database

Wire Strain Relief On Circuit Boards/Cards

IP.com Disclosure Number: IPCOM000120296D
Original Publication Date: 1991-Mar-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Related People

Kilgo, DE: AUTHOR

Abstract

Disclosed is a method of routing wire(s) from a printed circuit board or card to components not mounted on the board. In designs which require wires from a circuit board to another remote location, the wires need strain relief to prolong the connection.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Wire Strain Relief On Circuit Boards/Cards

      Disclosed is a method of routing wire(s) from a printed circuit
board or card to components not mounted on the board.  In designs
which require wires from a circuit board to another remote location,
the wires need strain relief to prolong the connection.

      Plastic hook and loop tapes, such as those marketed under the
trade name VELCRO, are used to provide the strain relief for 20 - 32
gauge wire(s).  The wires are routed through the tapes between their
interlocking surfaces (see Figure 1).  The structure is mounted to
the board with the adhesive backing on one of the tapes.  For smaller
gauge wires, a knot or tape around the wire may be used to prevent
slippage, as is also shown in Figure 1.

      Disclosed anonymously.