Browse Prior Art Database

Dry Film Resist Punch And Diaphragm Laminator

IP.com Disclosure Number: IPCOM000120386D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 66K

Publishing Venue

IBM

Related People

Freisitzer, N: AUTHOR [+2]

Abstract

A proposal suggests the use of prefabricated dry resist films with diaphragm application to semiconductor wafers to avoid wafer edge contamination and to eliminate a complex dry film resist trimming operation.

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This is the abbreviated version, containing approximately 63% of the total text.

Dry Film Resist Punch And Diaphragm Laminator

      A proposal suggests the use of prefabricated dry resist
films with diaphragm application to semiconductor wafers to avoid
wafer edge contamination and to eliminate a complex dry film resist
trimming operation.

      Under conventional methods a commercial strip laminator is used
which sandwiches the wafer between a polyester film sheet on the
bottom and the dry film resist on top.  Vacuum lamination is used to
bond the resist to the wafer, with an edge trimming and
predevelopment process required to trim and clean the resist from the
edge of the wafer.  An additional operation is required to peel the
polyester film from the back of the wafer.

      The proposed device includes a punch 1 (Fig. 1) and die 2
assembly equipped with an air cylinder 3 to move the punch.  A
laminator 4 equipped with a diaphragm 5 and a vacuum chuck 6 with an
appropriate vacuum port 7 are the other parts of the device.  The
punch is moved vertically to make circular sections from sheet resist
8 passed between the punch and die assembly.  The circular sections
have a diameter equal to that of the wafer inside the notch.

      The punch continues to move upward and contact is made with the
laminator so that the vacuum chuck in the circumference of the
laminator holds the circular section of resist.  The punch is
retracted and the laminator assembly moved by a transfer mechanism
(not shown) to another station where a wafer ce...