Browse Prior Art Database

Multi-Layer Ceramic Space Transformer for Wafer Level Stress

IP.com Disclosure Number: IPCOM000120388D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Longenbach, KF: AUTHOR [+2]

Abstract

A method of testing at the wafer level before dicing, chip joining and building of the test modules for reliability testing has been proposed for use in manufacturing semiconductor devices. The proposal suggests a tool consisting of customized thermal conduction module (TCM) substrates designed to function as space transformers. These permit signal and power distribution to test sites with fewer connections than are normally required.

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Multi-Layer Ceramic Space Transformer for Wafer Level Stress

      A method of testing at the wafer level before dicing,
chip joining and building of the test modules for reliability testing
has been proposed for use in manufacturing semiconductor devices.
The proposal suggests a tool consisting of customized thermal
conduction module (TCM) substrates designed to function as space
transformers. These permit signal and power distribution to test
sites with fewer connections than are normally required.

      The primary use of the proposed tool is to burn-in product at
the wafer level.  The advantages of stressing at that level have been
discussed previously, wherein it has been noted that probes could be
physically arranged to contact only the yielding chip sites.  This
proposal suggests a method which utilizes existing multi-layer
ceramic technology to aid in the probing of a fixed array of chip
sites or an entire wafer.

      The wafer probe configuration 1 (Fig. 1) has the probe units 2
held together in a sandwich configuration.  The face plate 3 at the
bottom of the configuration determines the site-to-site spacing and
is the piece aligned to the wafer 4 with its C4 arrays 5.  The wires
from each probe exit the top of each probe in a bundle 6 and extend
upward to connect to the TCM substrate 7 which sill function as a
space transformer.

      The wires in the bundle are fanned out into arrays 8 with the
spacing one each array fixed by a common guid...