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Subcooled Flow Boiling Scheme for Direct Immersion Cooling Of Three-Dimensional Electronic Packages in Large-Scale Computers Or Supercomputers

IP.com Disclosure Number: IPCOM000120389D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 4 page(s) / 127K

Publishing Venue

IBM

Related People

Anderson, TM: AUTHOR [+3]

Abstract

This concept incorporates the use of high performance miniature heat transfer devices directly attached to the semiconductor chips; flow control devices between chip-carrying substrates, and a free-discharge gravity return system cooling configuration. Several miniature heat transfer devices are attached to each chip to provide cooling by boiling of a fluorocarbon coolant flowing through the package. A flow control device is placed between the substrates and chips (with attached miniature heat transfer devices) to reduce flow cross-sectional area and provide the maximum coolant velocity at the minimum volumetric flow rate. The flow control device may be made of non-metallic or metallic material.

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This is the abbreviated version, containing approximately 52% of the total text.

Subcooled Flow Boiling Scheme for Direct Immersion Cooling Of Three-Dimensional
Electronic Packages in Large-Scale Computers Or Supercomputers

      This concept incorporates the use of high performance
miniature heat transfer devices directly attached to the
semiconductor chips; flow control devices between chip-carrying
substrates, and a free-discharge gravity return system cooling
configuration.  Several miniature heat transfer devices are attached
to each chip to provide cooling by boiling of a fluorocarbon coolant
flowing through the package.  A flow control device is placed between
the substrates and chips (with attached miniature heat transfer
devices) to reduce flow cross-sectional area and provide the maximum
coolant velocity at the minimum volumetric flow rate.  The flow
control device may be made of non-metallic or metallic material.
Metallic material is preferred so that the flow control device can
function as an auxiliary cooling device to help control subcooling of
the coolant, or act as a device to control electrostatic charge build
up by the flowing dielectric coolant.

      The basic miniature heat transfer device configuration consists
of a cylindrical base to attach to the chip, and a dual-slotted upper
section to increase heat transfer area and provide an improved means
for vapor bubbles to escape. Additional radial fins may be formed
from the same basic structure to even further enhance boiling heat
transfer and extend the critical heat flux.  The use of multiple
miniature heat transfer devices (instead of a single large heat sink
device) minimizes thermal stresses due to differing thermal
coefficients of expansion between the chip and attachment. Each
miniature heat transfer device is preferably made of a metallic
material with modest to high thermal condu...