Browse Prior Art Database

Thermocouple Attachment Technique

IP.com Disclosure Number: IPCOM000120413D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 79K

Publishing Venue

IBM

Related People

Carden, GR: AUTHOR [+6]

Abstract

Disclosed is a process for high precision, repeatable attachment of thermocouple (T/C) temperature sensors for high reliability semiconductor device and component temperature measurements.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Thermocouple Attachment Technique

      Disclosed is a process for high precision, repeatable
attachment of thermocouple (T/C) temperature sensors for high
reliability semiconductor device and component temperature
measurements.

      Trends in increased packaging densities with
micro-miniaturization of heat-producing semiconductor components and
assemblies increasingly demand full understanding of thermal
characteristics.  Reliable laboratory verification of actual
operating temperature conditions is essential.  Since attachment
techniques influence measurement accuracy, T/C attachments must
assure accurate, repeatable, reliable results over a wide range of
evaluation periods, test conditions, and over many device assembly
configurations.

      Equipment and processes to achieve these desired results which
address the variables of T/C attachment processes have been
developed.  The variables are controlled T/C placement precision in
the X, Y and Z axes, assured T/C bead size, intimacy of the contact
interface, and volume, thermal conductivity, adhesion, and immunity
to degradation under test conditions of the selected epoxy adhesive.

      Fig. 1 depicts the basic attributes of a T/C ideally placed by
this technique.  The T/C is normal to and in contact (D) with the
component.  T/C bead size variability can be minimized with a bead
control gage.  Epoxy volume (V), thermal conductivity (T), and test
life (L) are optimized through epoxy selection, processing, and cure.

      Fig. 2 and its magnifie...